Product Introduction





Product Specifications
| diameter | 1.75 mm |
| Net weight of wire | 1 kg |
| Spool material | ABS (70°C) |
| Spool size | Diameter: 200 mm; Height: 67 mm |
| Dry settings before printing | Blower Drying Oven: 55 °C, 8 hours X1 Series Printer Heat Bed: 65-75 ̊C, 12 hours |
| Printing and storing humidity | < 20% RH (sealed with desiccant) |
| Nozzle size | 0.2, 0.4, 0.6, 0.8 mm |
| Nozzle temperature | 190 - 230 ̊C |
| Print plate type | Low temperature, high temperature or textured PEI platform |
| Print deck preparation | Glue sticks |
| Plate temperature | 35 - 45 ̊C |
| Cooling fan | Open |
| Print speed | < 250 mm/s |
| Retract the length | 0.6 - 1.0 mm |
| Retract speed | 20 - 40 mm/s |
| Temperature inside the machine | 25 - 45 ̊C |
| Maximum overhang angle | 55 ̊C |
| Maximum bridge length | ~ 30mm |
| Supporting Materials | Support for PLA |
Product Introduction
Product Specifications





| diameter | 1.75 mm |
| Net weight of wire | 1 kg |
| Spool material | ABS (70°C) |
| Spool size | Diameter: 200 mm; Height: 67 mm |
| Dry settings before printing | Blower Drying Oven: 55 °C, 8 hours X1 Series Printer Heat Bed: 65-75 ̊C, 12 hours |
| Printing and storing humidity | < 20% RH (sealed with desiccant) |
| Nozzle size | 0.2, 0.4, 0.6, 0.8 mm |
| Nozzle temperature | 190 - 230 ̊C |
| Print plate type | Low temperature, high temperature or textured PEI platform |
| Print deck preparation | Glue sticks |
| Plate temperature | 35 - 45 ̊C |
| Cooling fan | Open |
| Print speed | < 250 mm/s |
| Retract the length | 0.6 - 1.0 mm |
| Retract speed | 20 - 40 mm/s |
| Temperature inside the machine | 25 - 45 ̊C |
| Maximum overhang angle | 55 ̊C |
| Maximum bridge length | ~ 30mm |
| Supporting Materials | Support for PLA |